From September 10–12, 2025, the 26th China International Optoelectronic Exposition (CIOE 2025) was successfully held at the Shenzhen World Exhibition & Convention Center.With the theme “Optics Connect Everything, Intelligence Shapes the Future”, the event focused on optical communications, optoelectronics, semiconductor packaging & inspection, new display technologies, and intelligent manufacturing. This year’s exhibition set new records with over 3,800 global exhibitors, 130,000 professional visitors, and a significantly expanded show scale.
Optoelectronics Gala | Exhibition Overview
High-Speed Interconnect | Equipment Evolution
With global data traffic surging, 800G optical modules have entered mass production, while 1.6T modules are accelerating toward commercialization. The rapid construction of AI computing centers and high-speed data centers has driven a sharp rise in demand for optical interconnects, placing higher requirements on semiconductor packaging and inspection systems.
Across the industry, production lines urgently require high-precision, high-throughput, and high-flexibility equipment platforms to support new-generation manufacturing needs.
At CIOE 2025, Bozhon Semiconductor returned with its flagship system, the MicroStar EH9722 Fully-Automatic High-Precision Die Bonder, delivering precision bonding and vision-based inspection solutions for high-speed optical communications. It provides strong support for higher yields and faster mass-production cycles.
- High-Precision Bonding – Placement accuracy up to ±3 μm; supports eutectic bonding, epoxy bonding, dispensing, UV curing, and more.
- Multi-Process Integration – Flexible process configuration for 800G / 1.6T optical modules and advanced chip-level packaging.
- Modular Platform – Open architecture with scalable modular design enables quick process expansion and customized upgrades.
As a core solution for optical communications and advanced semiconductor packaging, the MicroStar EH9722 provides a one-stop path from R&D to volume production, combining stable performance, high accuracy, and adaptable process modules. Its open platform meets dual demands for efficiency and yield, helping customers remain competitive in the high-speed interconnect era.
Industry Engagement | On-Site Communication
The booth further attracted attention from well-known industry media, who covered exhibition highlights and conducted technical interviews on packaging paths and optical interconnect trends.
