The MicroStar Series is a series of leading multifunctional Die Attach Equipments with high efficiency (12-50s/pcs) and high precision (±0.5~±3μm) . This series serves functions of eutectic bonding, dipping glue bonding and flip chip bonding. It is also able to meet the needs of multi-chip bonding. Its modular design enables the equipment to have highly flexible manufacturing capability. Also, equipped with an intelligent calibration and data management system, the MicroStar Series is capable to trace and manage process

The CeciStar Series A0l lnspection machine provides high performance, fully automated optical inspectionof packaged integrated circuit(IC) components. lt leverages high sensitivity with 2D/3D inspection andmeasurements to determine final package quality for a wide range of device types and sizes.

FastStar series die bonders are high-speed, high-precision equipment designed for multi-chip packagingoffering accuracy up to ±7μm@3σ. Featuring an open architecture and modular design, they provide excep.tional on-demand customization capabilities, supporting wafers up to 12 inches. The system accommodatesvarious packaging processes such as die bonding, SiP, and UV curing.