Fully Automatic High Precision Eutectic Die Bonding Machine
MicroStar-EF8622
EF8622 is a fully automatic high-precision die bonder designed for COC, COS, and Gold-Box process applications. It integrates both epoxy die bonding and eutectic die bonding capabilities, meeting the needs of complex multi-chip assembly processes.
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High precision -
High efficiency -
High flexibility -
High expandability
Application
Scenarios
A solid investment for maximizing productivity – from R&D to volume, automated bonding – all in one bonder. The MicroStar EF8622 die bonder is based on Bozhon semiconductor die bonder design but includes options to even further maximize productivity, reduce programming time by up to 95%, and improve the overall bonder productivity. The highly flexible MicroStar EF8622 is ideally suited for a range of markets and applications.
Optical module
Sensor
RF devices
Power semiconductor
Lidar
Microwaves and Antennas
Product
Parameters
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Placement accuracy±1.5μm @ 3σ
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Placement processEutectic/Adhesive dipping
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Efficiency25-35s(Eutectic)12-15s (Adhesivedipping)
FEATURES
Bozhon Semiconductor MicroStar Eutectic Die Bonder excels in high-rate optical module device placement scenarios, and can effectively solve the pain points of optoelectronic placement:
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High Precision -
High Efficiency of Eutectic -
Intelligent Design -
Dual View Module
High Precision
The repeated accuracy of the mounting air flotation platform is 0.1um
High Efficiency of Eutectic
The eutectic temperature rising from 200 to 300℃
only takes 3.2s and the cooling from 340 and 200℃
only takes 6.5s）
Intelligent Design
Streamlined design, compatible with AGV docking 12 tool holders for fully automatic dynamic tool changing
Dual View Module
Free switching of high and low magnification lenses (1&5x)
Consult with our technology specialists. Consulting & support where you need them.
Bozhon semiconductor experts are here to help you.
Bozhon semiconductor experts are here to help you.
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