From February 26–28, theAsia Photonics Expo 2025 (APE 2025)was successfully held in Singapore. As one of the most influential optoelectronics exhibitions in Asia, APE focuses on cutting-edge technologies and emerging applications in optical communications, precision optics, lasers, infrared, intelligent sensing, quantum, and new display technologies. The event provides a platform for global photonics companies to showcase innovations, exchange industry insights, and explore international business opportunities.

At the beginning of the new year, Bozhon Semiconductor made its first overseas appearance under the theme: “Innovating the Future, Empowering AI-Era Photonics Packaging.” The company showcased the newly upgraded MicroStar EF8622 Eutectic Die Bonder and its advanced packaging solutions for optoelectronic chips, highlighting the innovation strength of Chinese intelligent manufacturing.

During the exhibition, Bozhon Semiconductor’s booth attracted significant attention from international visitors, customers, and industry experts. Many attendees stopped for technical discussions and cooperation inquiries, creating a lively and energetic atmosphere throughout the show.

Deepening Presence in Southeast Asia | Accelerating Global Strategy

Guided by customer needs, Bozhon Semiconductor continues to strengthen its international strategy and actively expand overseas markets. Leveraging strong R&D capabilities, a comprehensive product portfolio, and diversified business models, the company has delivered equipment to multiple regions including theUnited States and Thailand, while developing close partnerships with local enterprises to enhance product performance and after-sales services.

Advanced Packaging Equipment | Technology Leading the Trend

With extensive experience in optical modules, laser devices, and microwave/radio-frequency applications, the Star-Way product family has become widely recognized by industry clients.At APE 2025, Bozhon Semiconductor showcased theMicroStar EF8622 Eutectic Die Bonder, an upgraded model of EF8622.The system retains its high precision and reliability while offering significant improvements in process compatibility. It supports multiple packaging methods includingCOC, COS, Gold-Box, and Flip-Chip.Through an optimized programmable pulse heating algorithm, the EF8622 ensures accurate temperature control throughout the eutectic process, eliminating surface temperature overshoot.Additionally, while maintaining its dual-station design, the machine adopts a streamlined structure that enables seamless connection with AGV automated loading and unloading systems, effectively enhancing productivity and enabling full production-line data interconnectivity.

By participating in APE 2025, Bozhon Semiconductor not only showcased its latest technological achievements in the photonics industry, but also further strengthened its brand recognition and influence in overseas markets.Looking ahead, Bozhon Semiconductor will continue to cultivate the Southeast Asian market, driven by innovation and guaranteed by quality, accelerating its global expansion and delivering high-performance packaging solutions to partners worldwide.

Together, we look forward to a smarter, interconnected future.